When you’re dealing with stubborn acne prone skin, while chemical peels provide a deeper exfoliation and improve the appearance of acne, they can be harsh on the skin resulting in redness, irritation and sensitivity. And while physical peels are gentler, they might not serve a long lasting result as chemical peels.
Our R&D team recognized these struggles and designed a formulation that brings the best of both worlds. For an effective acne treatment, you need a combination of physical and chemical peels with an active ingredient that has been used historical for centuries in treating acne.
GWANG PEEL 72 hr Professional is a regenerative peeling kit designed specifically for acne-prone skin. High-purity 99% Spongilla spicules micro silica combines its physical peeling power with BHA, IntoCell-EGF, antimicrobial and anti-inflammatory peptide solutions.
Various growth factors and peptides contained in the CELL BOOSTER promote regeneration and nourishment of acne scars and damages of the skin.
We typically process and ship orders within 1 week, with shipping costs calculated at checkout based on your location and selected method. Free shipping is available for orders over $1000, depending on the promotion. Once your order ships, you will receive a confirmation email with a tracking number to monitor your package’s status. Standard shipping usually takes 5-7 business days, while express options are available for faster delivery. If you need to change your shipping address after placing an order, please contact us as soon as possible. In case of lost or stolen packages, we recommend reaching out to the carrier first, but our support team is happy to assist. For returns, we accept items within 1 week, provided they are unused and in their original packaging. Refunds are processed within 3-5 business days after we receive and inspect the returned item. Exchanges are also available if you need a different size or variant of a product. If you have any questions about shipping or returns, feel free to contact our support team.